Engineering publications brought to you by Mark Allen

ASIC & SoC

EnSilica establishes new engineering hub in Cambridge

Silicon Labs unveils Series 3 SoCs targeting next generation IoT devices

EnSilica unveils dual-beam, dual-polarisation Ku-band analogue beamformer chipset

Microchip presents cost-optimised PolarFire Core FPGAs and SoCs

Strong reasons to be positive

Xiphera partners with Siemens Cre8Ventures to strengthen automotive security

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

Semidynamics unveils Cervell All-in-One RISC-V NPU

BrainChip working with Chelpis-Mirle on security solution

Synaptics unveils first Veros Wi-Fi 7 family tailored for the IoT

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

Cadence enables next-gen AI and HPC systems with ‘fastest’ IP memory system solution