Engineering publications brought to you by Mark Allen

Neil Tyler

Internet of Things

Winbond TrustME W77Q Secure Flash obtains SESIP Level 2 Certification

Internet of Things

Memfault and NXP to accelerate development and improve IoT products in the field

Electronics

Flex Logix launches EasyVision with ready-to-use models and AI acceleration hardware

Sensors

SiLC partners with Cloud Light for volume manufacturing of Eyeonic vision sensors

Power

40W and 60W 2” x 1” DC-DC converters

Electronics

NAWA triples manufacturing capacity of nano-based energy storage electrodes

Power

Renesas releases RZ/T2M motor control MPU

Board Level Design

Soracom collaboration with Sony Semiconductor Solutions' SPRESENSE IoT MCUs

Test & Measurement

Tektronix unveils the 2 Series Mixed Signal Oscilloscope

Embedded Software

Riviera-PRO Supports OpenCPI with latest release

Robotics & UAVs

Get Ready for UK Festival of Robotics 2022

Policy & Business

Vicor opens industry’s first 'ChiP' fabrication facility