Engineering publications brought to you by Mark Allen

Neil Tyler

Memory

The Six Semiconductor announces tape-out of two 7nm test chips

EDA & Design Software

Tachyum validates Prodigy Universal Processor with Kubernetes

Sensors

Oculi forms strategic partnership with GlobalFoundries

EDA & Design Software

Cadence delivers 13 new VIP solutions

System Design

Endura precision timing solution enables faster GPS signal acquisition

Electronics

Texas Instruments selects Utah for its next 300mm wafer fab

Electronics

The promise of a fully connected society

Memory

Alliance Memory expands CMOS DDR4 SDRAMs line-up

Sensors

Murata unveils highly accurate soil monitoring system

Interconnection

NTU scientists develop ‘Lego-like’ universal connector

Power

CAP-XX launches ultra-thin prismatic supercapacitor for space-constrained devices

Electronics

Infineon begins fab construction in Dresden