Engineering publications brought to you by Mark Allen

Neil Tyler

Automotive

Nexperia introduces optimised flip-chip package technology for automotive ESD protection

Wireless Technology

RED Horticulture partners with Panasonic to deliver innovative LED lighting systems

Electronics

Micron to add surcharge on products as a result of US tariffs

Power

Toshiba launches SCiB module with improved heat dissipation performance

Memory

KIOXIA, AIO Core and Kyocera develop PCIe 5.0-compatible broadband optical SSD

Sensors

ST's latest accelerometer delivers longer battery life and smarter sensing

EDA & Design Software

Siemens acquires DownStream Technologies expanding PCB design-to-manufacturing flow

Sensors

3D Linear Hall effect sensor simplifies rotary motion and proximity detection

Sensors

Allegro MicroSystems expands motor control and thermal management solutions

Electronics

Smiths Interconnect expands cable harness production capacity at its Tunisian facility

Electronics

China responds to Trump’s tariffs shaking up the chip supply chain

Electronics

Avnet ASIC selected as channel partner by Hailo for TSMC silicon production