Engineering publications brought to you by Mark Allen

Neil Tyler

Sensors

Advanced InSb Hall Element sensors for rotation and current detection applications

Artificial Intelligence

Race to develop AI chips ‘hots up’

Interconnection

Molex targets data centres with ‘Plug and Play’ VersaBeam EBO interconnect solutions

Electronics

AI platform enables customisable packaging solutions for AI applications

Electronics

Zuken signs agreement to join IBM Research AI Hardware Center

Internet of Things

MediaTek’s Genio 720 and Genio 520 IoT platforms target generative AI applications

EDA & Design Software

Toshiba unveils latest version of its Motor Control Studio software

ASIC & SoC

Renesas introduces Bluetooth Low Energy SoC for automotive applications

Memory

Brite Semiconductor releases DDR3/4, LPDDR3/4 Combo IP

Interconnection

Shaping future cable assemblies

ASIC & SoC

Microchip’s PolarFire SoC FPGAs achieve AEC-Q100 qualification

Electronics

New semiconductor design centre strengthens UK chip design capabilities