Engineering publications brought to you by Mark Allen

Farnell adds NXP microcontrollers and FRDM development boards to portfolio

UltraPQ-Suite supports specialised implementations of post-quantum cryptography

EU invests €6 million in new networks to power factories of the future

ETSI Technical Specification sets international benchmark for securing AI

Anritsu and MVG develop Wi-Fi 7 OTA measurement solution

Microchip introduces MCU family to simplify analogue sensor design

Littelfuse introduces gate driver for high-frequency power applications

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Outlook Supplement 2025

Outlook 2025: Embracing the chiplet journey

Outlook 2025: Building resilience in turbulent times

Outlook 2025: Continuous Observability

Most Read

xMEMS Labs looks to secure ‘foothold’ in booming AI glasses market

Innovate UK awards consortium £1.65m to create Open Architecture Quantum testbed

Wayve opens Testing and Development Centre in Japan

Challenging times

CSignum secures £6m to transform underwater wireless networks

OMNIVISION launches image sensor for automotive driver monitoring systems

Renesas debuts new additions to its RA0 microcontroller portfolio

VeriSilicon launches ultra-low power OpenGL ES GPU for wearables

Popular Categories

Internet of Things Internet of Things
Wireless Technology Wireless Technology
Network Security Network Security
Power Power
Manufacturing Manufacturing
Interconnection Interconnection
Automotive Automotive
Embedded Systems Embedded Systems

NEW ELECTRONICS APRIL 2025

Cover Story: Dynamic and Innovative

The annual gathering of the embedded systems industry in Nuremberg last month didn't disappoint, with a host of new innovations and solutions.

Download the latest New Electronics magazine as an interactive issue or PDF file. Request a free printed copy here

APRIL ISSUE
ISSUE ARCHIVE

Features

Challenging times

E-band in space

Collaboration in PCB Design: Enhancing Innovation and Efficiency

Comment

TSMC unveils details regarding its advanced A14 node

Samsung set to end DDR4 production in the face of Chinese competition

TSMC remains bullish despite tariff headwinds

Interviews

Putting the building blocks in place

Shaping future cable assemblies

Demanding Data

Capacitors get really ‘super’

Technology Spotlights

Prismatic Supercapacitors - Maximum performance in minimal space!

Zero Profile Receptacles Keep Components Flush

Empowering businesses through the new Pilot Line service

OKW’s Updated NET-BOX: Ideal For Wall-Mounted Embedded Electronic Systems

HMI solutions for medical applications - The importance of the medical standard for medical devices

Receptacles For PCB Components with Short Leads

Product Launches

OMNIVISION launches image sensor for automotive driver monitoring systems

Back flip FPC connector features staggered contact array for narrow-pitch

Navitas’ SiCPAK power modules deliver reliability at high temperatures