Engineering publications brought to you by Mark Allen

Infineon introduces AIROC CYW20829 Bluetooth LE system on chip

Apple valuation tops $3trn

Thick film current sense resistors target sensing applications

ASPEED and CEVA collaborate to improve voice on Cupola360 SoCs

Silicon Photonics platform with monolithically integrated III-V lasers

First silicon demonstration wafers with integrated embedded ReRAM module

EIC Accelerator programme awards funding to SiPearl

First Open Wi-Fi 'HaLow' development platform

24-position optical encoder switch

Supermicro records world first TPCx-HCI benchmark result

Growing need for device security in 2022

Delivering on climate goals