Engineering publications brought to you by Mark Allen

Sensors

Shaping the future

Hot electrons generate light in chips

3D printed objects use backscatter to communicate using Wi-Fi

Tri-stimulus colour sensor

Allegro MicroSystems introduces angle sensor ICs

OUTLOOK 2018 – The explosive growth of inter-connected devices makes sensors an integral part of digital ecosystems

ROHM announces first noise-tolerant op-amps

Researchers develop smart, ultra-thin microfibre sensor

Allegro MicroSystems introduces angle sensor IC

ams launches NFC Sensor Interface for Industrial IoT

Yokogawa adds CXPI automotive serial bus analysis option to DLM oscilloscope series

Sony strengthens GS CMOS portfolio