Engineering publications brought to you by Mark Allen

Semiconductors

Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D

TSMC set to build 9 facilities in 2025

Foxconn to open Europe’s first fan-out wafer level packaging plant

Renesas extends RZ/A MPU line-up with RZ/A3M for HMI solutions

MediaTek’s Dimensity 9400e mobile platform provides enhanced AI and connectivity

Samsung said to be near to securing 2nm orders

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Global SiC substrate revenue falls 9% in 2024 although long term demand remains strong

Semidynamics unveils Cervell All-in-One RISC-V NPU

Infineon’s Dresden fab receives final funding approval from German government

Location tracking of AI chips aims to curb smuggling