Engineering publications brought to you by Mark Allen

Electronics

Intel begins ‘major’ programme of layoffs and closes automotive unit

Farnell enhances mission-critical portfolio

Liquid Instruments brings Agentic AI to Test and Measurement

TDK selects Arrow as first Pan-European distributor for TDK-Lambda products

Rapidus collaborating with Siemens on 2nm semiconductor designs

Arteris unveils Magillem Packaging for IP blocks and chiplets

Siemens introduces new solutions to support 2.5/3D IC designs

Challenging times

QNX and Vector to launch foundational vehicle software platform

India looks to boost domestic rare earth capacity

Siemens deploys AI to ‘turbocharge’ semiconductor and PCB design

Continental establishes fabless chip unit