Engineering publications brought to you by Mark Allen

Electronics

Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D

Sention Technologies raises £3.7m to revolutionise battery diagnostics

TSMC set to build 9 facilities in 2025

Merck and imec to develop a disruptive MicroPhysiological Systems platform

Infineon and NVIDIA collaborate on industry-first 800V power delivery architecture for AI data centres

Kardome and LG look to transform voice user interfaces with spatial hearing AI

Foxconn to open Europe’s first fan-out wafer level packaging plant

Strong reasons to be positive

Xiphera partners with Siemens Cre8Ventures to strengthen automotive security

Quantum technology agreement signed by EU and Japan

Imec and TNO launch Holst Centre Photonics Lab

Infineon’s PSOC 4100T Plus MCU offers advanced sensing capabilities and system control