Engineering publications brought to you by Mark Allen

Samsung and Huawei embrace DIY

All-optical technique creates frequency doubling in amorphous dielectric material

STM32 SoC accelerates creation of smart devices

Diodes receives funding package from Scottish Enterprise

CES 2020 - NXP debuts i.MX applications processor with neural processing unit

CES 2020 - Bluetooth SIG unveils LE Audio

Mini-size 80 EVOTEC table-top plastic enclosures

Integrated Device Technology starts operating as Renesas Electronics America

Nexeon says SUNRISE Project performing better than expected

CES 2020 - CEVA's SenslinQ Platform to streamline development of contextually aware IoT devices

CES 2020 - “World’s smallest” 3D image sensor

NXP unveils S32G automotive network processors