Engineering publications brought to you by Mark Allen

OMNIVISION launches image sensor for automotive driver monitoring systems

ByteSnap launches SnapPro IQ accelerating PCBA test solutions and securing IP

xMEMS Labs looks to secure ‘foothold’ in booming AI glasses market

CSignum secures £6m to transform underwater wireless networks

Samsung set to end DDR4 production in the face of Chinese competition

Wayve opens Testing and Development Centre in Japan

Challenging times

VeriSilicon launches ultra-low power OpenGL ES GPU for wearables

Renesas debuts new additions to its RA0 microcontroller portfolio

Back flip FPC connector features staggered contact array for narrow-pitch

TSMC remains bullish despite tariff headwinds

Cadence to acquire Arm Artisan Foundation IP business