The simple one-piece design of the components enables a high integration and miniaturisation of board-to-board and board-to-module RF interconnections. GDBC series contacts have been designed to be very easy to use in the assembly as they require no SMT.
They offer the lowest total-cost-of-ownership on the market and are suitable for multiple connections and complex stack ups in 5G systems.
Technical details of 2nd generation GDBC contacts include a frequency from DC up to 8.5 GHz, impedance of 50 Ω, insulation resistance of 5000 MΩ and a dielectric withstand voltage of 750 Vrms. VSWR is 1.12:1 at 3.0 GHz, 1.22:1 at 6.0 GHz and 1.35:1 at 8.5 GHz.
