Designed for demanding applications in Telcom Hot Swap, these MOSFETs provide a low on state resistance and a robust linear mode performance with a wide Safe Operating Area (SOA) to manage demanding telecom applications where performance, reliability, and quality are essential.
The AOTL66518 and AOB66518L have a max junction temperature up to 175°C and protects the load by limiting high in rush currents in soft-start, eFuse, and Hot Swap application conditions.
The AOTL66518 delivers high robustness with a 150V MOSFET in a TOLL package. The TOLL package offers a 30% smaller footprint than a TO-263 (D2PAK) package and has a higher current capability due to clip technology. The device has a very low thermal resistance from silicon junction to the bottom of the package case (Rthjc) compared to TO-263.
These features enable telecom designers to reduce the number of MOSFETs in parallel.