Harwin adds to board level shielding portfolio

Harwin has announced the introduction of three new shielding cans to assist engineers dealing with EMI/RFI issues in their PCB designs.

These cans are supplied in a tape-and-reel format and increase the company’s existing range of EMC products. The new can dimensions are 10mm x 10mm, 15mm x 10mm and 30mm x 10mm, all with a 3mm profile height and 0.15mm thickness material.

Each can is made from a single piece of unplated Nickel Silver alloy, with a simple 5-sided shape. They are easy for engineers to fit onto a board and secondary soldering operations are eliminated, as they can be attached with clips that can be soldered at the same time as the rest of the items populating the PCB. This helps avoid risk of damaging sensitive circuitry through exposure to extreme heat during hand soldering.

“Tackling electromagnetic emissions is a vital aspect of modern electronic designs, particularly for those involved in wireless communication,” explained Neil Moore, Product Manager for EMC & Industrial Products at Harwin. “The simple shielding cans and clips from Harwin have gained widespread popularity with electronics engineers. Now we are delivering a wider choice, aimed at helping with EMC requirements in the smallest handheld and wireless applications.”

The removable cans also provide easy access to the devices and circuitry underneath, when rework, maintenance or component replacement is necessary – cans can simply be unplugged and re-inserted as required. Inconvenient de-soldering and solder clean-up is all removed from the rework process required by other EMC can styles.

With the new additions, the Harwin EMI/RFI shielding range covers 10mm square to 50mm x 25mm sizes, with heights from 2.5mm to 5mm and material thicknesses of 0.15mm to 0.30mm. Ready-made, these products are all available in volume directly from stock.