The products integrate NAND chips fabricated with a 15nm process technology with a controller to manage basic control functions for NAND applications in a single package.
As a complement to Toshiba’s previous product group of e∙MMC, the new products support applications such as instrument clusters that require e∙MMC storage solutions to operate at temperatures ranging from -40C to 105°C.
The JEDEC e∙MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It is said to simplify system development, allowing manufacturers to minimise development costs and speed time to market for new and upgraded products.
Features standardised in JEDEC e∙MMC Version 5.1, such as BKOPS control, cache barrier, cache flushing report, large RPMB write and command queuing, are applied to the new products to enhance usability.
