Engineering publications brought to you by Mark Allen

Product Launches

Board Level Design

Compact Instrument Enclosures for Desktop & Portable Electronics

CPUs

RF3688 802.11 b/g/a/n dual band FEM

Interconnection

Differential switching ICs support next gen high speed interfaces

Test & Measurement

High voltage system SourceMeter

Interconnection

Cliff expands product range to satisfy growing demand

Power

TDK-Lambda adds to GWS series of green power supplies

Power

4:1 input 204W quarter brick dc/dc converter

CPUs

RF5540 4.9 to 5.85GHz switch and LNA front end solution

Power

Power manager charges LiFePO4 cells at 3.5A

Test & Measurement

New 16 channel temperature input module

Board Level Design

EmbeddedXpress industry standard for COM based SBCs

Manufacturing

Embedded World: Mitsubishi Electric unveils colour tft lcd modules