Engineering publications brought to you by Mark Allen

Product Launches

Wireless Technology

Synaptics unveils first Veros Wi-Fi 7 family tailored for the IoT

Communications

Microchip expands data centre connectivity, storage and compute portfolios

Interconnection

M12 L- and T-coded connectors ensure reliability and durability

Power

SemiQ 1200 V Gen3 SiC MOSFET modules reduce switching losses

Power

ROHM develops compact high heat dissipation SiC power modules

Test & Measurement

Anritsu and MVG develop Wi-Fi 7 OTA measurement solution

Sensors

Microchip introduces MCU family to simplify analogue sensor design

Power

Littelfuse introduces gate driver for high-frequency power applications

Sensors

OMNIVISION launches image sensor for automotive driver monitoring systems

Interconnection

Back flip FPC connector features staggered contact array for narrow-pitch

Power

Navitas’ SiCPAK power modules deliver reliability at high temperatures

Power

SemiQ 1200 V SiC MOSFET modules enable more compact, cost-optimised systems