Engineering publications brought to you by Mark Allen

News

Research Design

Institutes collaborate to bring advanced materials and products to market

Manufacturing

Septentrio signs global distribution agreement with Digi-Key

Test & Measurement

Yokogawa launches next generation mixed signal oscilloscope

Displays

Marvell and TSMC collaborate on 5nm technology

CPUs

Kneron unveils next-generation AI chip

Power

RS improves HMI for IoT development with RX72N Envision Kit

EDA & Design Software

Toshiba’s unveils distributed co-simulation platform

EDA & Design Software

Flex Logix announces nnMAX AI inference IP in development

Consumer

Ultraleap brings natural XR interactions to Snapdragon XR2 5G reference design

Consumer

Renesas rolls out a 48V mobility combination solution

Board Level Design

Ansys achieves certification of its multiphysics solutions for TSMC’s 3nm process technology

Automotive

NXP unveils in-vehicle multi-device wireless charging solutions