With form factors that are 70 percent smaller than traditional chip-scale packaging, the Artix and Zynq UltraScale+ devices will be able to address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.
Based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, both devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.
“Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of compute density to enable the smallest form factor systems,” said Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. “These new cost-optimised additions to our UltraScale+ portfolio are powerful enhancements that leverage the architecture and production-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of systems worldwide.”
The Artix UltraScale+ family is built on a production-proven FPGA architecture and is intended for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact “8K-ready” video broadcasting. Artix UltraScale+ devices deliver 16 gigabits-per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class.
Cost-optimised, the Zynq UltraScale+ MPSoCs include the new ZU1 and production-proven ZU2 and ZU3 devices, all available in InFO packaging.
As part of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications. ZU1 is built for miniaturised compute-intensive applications and powered by a heterogeneous Arm processor-based multicore processor subsystem, while also being able to migrate to common package footprints for greater compute.
These new devices round out the company's portfolio and provide scalability for customers to develop multiple solutions using the same Xilinx platform.
Security is a critical component in Xilinx designs, and both the Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ portfolio. Included are RSA-4096 authentication, AES-CGM decryption, DPA countermeasures, and Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product life cycle, meeting the security needs for both defense and commercial projects.
