Winbond memory chip now supports NXP Layerscape LS1012A

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Winbond Electronics, a supplier of semiconductor memory solutions, has said that its SpiStack dual-die NOR+NAND code storage product has been included on NXP's FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.

NXP said that it had selected Winbond’s W25M161AW SpiStack product for its new FRWY-LS1012A development board for the LS1012A processor as it provides 16Mbits of serial NOR Flash memory for the board’s boot code, and 1Gbit of serial NAND for its Linux operating system.

The stacked-die construction of the SpiStack products and the software Chip Select capability developed by Winbond enable a serial NOR Flash die for fast boot and a serial NAND die for high memory density to be accommodated in an 8-terminal WSON package with a standard 8mm x 6mm footprint and pin-out.

“The W25M161AW SpiStack device is the perfect pairing with our Layerscape LS1012A SoC,” commented Jeff Steinheider, director, product marketing, NXP Industrial Applications Processors. “It saves board real-estate for compact designs with the LS1012A, while still providing 1Gbit of storage for a full featured Linux OS.”

Winbond’s High-Performance Serial NAND technology supports a two-chip dual-quad interface which gives a maximum data transfer rate of 166MB/s and this high-speed Read operation means that the W25N01JW chip can replace SPI NOR Flash memory in automotive applications such as data storage for instrument clusters or the Centre Information Display (CID).

That level of performance is seen as an important gain by automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of 7” and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher. At these capacities, serial NAND Flash has a markedly lower unit cost than SPI NOR Flash, and occupies a smaller board area per Mbit of storage capacity.