TSMC’s 28HPC process in volume production

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TSMC has commenced volume production of its 28nm High Performance Compact (HPC) process.

Described as a compact version of the company's 28HPM process, 28HPC is optimised for mobile and consumer devices with a small footprint and high performance requirements. TSMC claims it delivers the best 64bit CPU and LTE modem performance under a fixed total design power budget for smartphones and tablets. Compared with 28LP, 28HPM provides 10% smaller die size and 30% lower power at all levels of speed, or over 20% speed improvement at the same power. This was achieved through tighter process control, more efficient design solutions and new process features. "The arrival of our 28HPC process is in tune with market demand for cost effective SoC applications," said TSMC president and co CEO, Dr Mark Liu. "With a comprehensive IP ecosystem, our customers can quickly achieve new levels of product integration and innovation." So far, 10 customers have taped out products using the 28HPC process. A further 70 are in the pipeline, TSMC said in a statement.