Haptic feedback for mobile and wearable electronics

1 min read

Boréas Technologies, a developer of ultra-low-power haptic technologies, has introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback ​in mobile and wearable consumer products.

Featuring WLCSP packaging, the BOS1901CW is just 2.1x2.2x0.6mm and consumes significantly less power than many other piezoelectric (piezo) competitors, making it small and low-power enough for the most resource-constrained devices.

Tactai, a pioneer in recreating lifelike touch sensations through its embedded haptics platforms, used the BOS1901CW to develop a digital active-stylus reference design.

“From digital pens that simulate the feel of writing on paper to touch-enabled buttons and keyboards, users want natural tactile feedback when they’re interacting with their personal electronic products,” explained Jonathan Fiene, chief technology officer, Tactai. “With its small size, straightforward digital interface, and power profile, the BOS1901CW has allowed Tactai to deploy our unique real-time dynamic rendering system into a wide range of new and exciting next-generation piezoelectric-driven mobile and handheld haptic devices.”

Boréas is looking to target a global haptics component market that could be worth $4.8 billion by 2030, according to James Hayward, principal analyst at IDTechEx.

“Boréas Technologies is competing in some promising emerging technology areas within haptics,” said Hayward. “Enabling haptic feedback through ‘buttons’ and other touch interfaces in space- and power-constrained devices, Boréas can potentially provide a key part of the solution, particularly where it relates to any use of piezoelectric actuators.”

Like Boréas’ existing BOS1901CQ, the BOS1901CW is a high-voltage low-power piezo driver IC that is based on the company's patented CapDrive technology, a proprietary scalable piezo driver architecture that provides the foundation for Boréas’ haptic chips

The BOS1901CW features:

  • Power savings — provides 10X power savings over other piezo solutions and delivers 4X to 20X power savings over other incumbent technologies (LRA, ERM);
  • Tiny hardware footprint of 2.1x2.2x0.6 mm — making it suitable for space-constrained wearables and mobile devices
  • Low latency response — delivers start up time < 300 µs, providing faster response times for superior real-time haptic performance
  • Low bill of material (BOM) cost — provides a solution that is cost-compatible with most applications
  • Off-the-shelf compatibility — supports a wide range of piezoelectric haptic actuators, speeding design-to-manufacture of HD haptic feedback solutions
  • Amplifies high-resolution haptic effects — supports third-party haptic-effect libraries, allowing designers to customize user experiences
  • Wide supply voltage range: 3 to 5.5V — supports integration in most devices without any extra power-supply hardware, reducing BOM