CVD diamond material addresses semiconductor thermal management

DIAFILM 200 is a top end grade of chemical vapour deposition (cvd) diamond thermal material. According to Element Six, it has been designed for users that work with high power, or high power density devices, and require extreme performance for thermal packaging needs. The new product is a DIAFILM TM 200 material and has a thermal conductivity of Tc>2000 W/mK. It is fully isotropic - it spreads the heat equally efficient in a planar direction as well as through the material. "Diamond is the highest thermally conductive material and this new product pushes thermal conductivity of commercially available diamond to groundbreaking new levels," said Thomas Obeloer, business development manager, Thermal Applications, at Element Six. "We have already had positive feedback from customers in the telecommunications and laser diode sector who were early adopters of this product and now the product is commercially available we look forward to seeing other customers benefit from its unique speed of thermal conductivity and insulation capabilities." Material blanks are available in standard thicknesses and the use of high quality, sputter deposited thin film metallisation is offered. DIAFILM 200 is being launched on 22nd March 2011 at Semitherm 27 in Santa Clara, California.