Integrating the Hailo-8 processor, the modules can be plugged into a variety of edge devices, benefitting multiple sectors with superior AI capabilities including smart cities, smart retail, industry 4.0, and smart homes.
The modules have been designed to enable customers to integrate high performance AI capabilities into edge devices, providing a more flexible and optimised solution for accelerating a large range of Deep Learning-based applications with greater efficiency.
Hailo's AI acceleration modules integrate into standard frameworks, such as TensorFlow and ONNX, which are both supported by Hailo's Dataflow Compiler. Customers can quickly port their Neural Networks (NNs) into the Hailo-8 processor, ensuring high-performance, enabling smarter AI products, and accelerating time-to-market.
This plug-in solution, described by Hailo as a 'game changer', comes at a time when industries are increasingly utilizing edge devices that are both high-performing and cost-effective. For example, fanless AI edge boxes are in high demand as they allow many cameras or sensors to be connected to a single intelligent processing device in outdoor deployment.
Hailo’s modules – with their high-performing Hailo-8 AI processor delivering 26 Tera-Operations Per Second (TOPS) and high-power efficiency of 3 TOPS/W – can be plugged into any existing edge device with the appropriate M.2 or Mini PCIe sockets, delivering unprecedented performance while reducing latency and improving privacy.
“Manufacturers across industries understand how crucial it is to integrate AI capabilities into their edge devices. Simply put, solutions without AI can no longer compete,” said Orr Danon, CEO of Hailo. “Our new Hailo-8 M.2 and Mini PCIe modules will empower companies worldwide to create new powerful, cost-efficient, innovative AI-based products with a short time-to-market – while staying within the systems’ thermal constraints. The high efficiency and top performance of Hailo’s modules are a true gamechanger for the edge market.”
The Hailo-8 M.2 module is already integrated into the next generation of Foxconn’s “BOXiedge" with no redesign required for the PCB. The solution provides energy efficiency for standalone AI inference nodes, benefiting applications including smart cities, smart retail, industry 4.0, and smart medical.
Commenting Dr. Gene Liu, VP of Semiconductor Subgroup at Foxconn Technology Group said, “Hailo’s M.2 and Mini PCIe modules, together with the high-performance Hailo-8 AI chip, will allow many rapidly evolving industries to adopt advanced technologies in a very short time, ushering in a new generation of high performance, low power, and smarter AI-based solutions.”