Engineering publications brought to you by Mark Allen

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C-5M Super Galaxy Cockpit to be upgraded using INTEGRITY-178 tuMP

AMD and ECARX collaborate on immersive digital cockpit computing platform

InnovationLab demonstrates breakthrough additive PCB production method

Mouser signs global distribution deal with Advanced Photonix

June decline in IC market reported

Ultra-compact audio module enhances the performance of hearables

Quantum Exponential invests in QLM Technology

Renesas unveils MPUs with RTOS support enabling HMI and quick start-tup

A huge first step

Multiple mounting options for OKW’s modular ART-CASE enclosure

Nexeon raises over $200m to fund battery materials manufacturing

Avery unveils 800G Ethernet VIP virtual network co-simulation platform