Engineering publications brought to you by Mark Allen

Consumer

Digital signage apps targeted with 42in flexible display just 3mm thick

Embedded World 2013: 8bit apps targeted with lowest power, lowest cost RX mcu

Chip scale packages might be thinner, but their profile is growing

Engineering initiative creates application focused design tool portfolio

Embedded World 2013: Microchip unveils BodyCom technology

MWC: ARM's big.LITTLE concept attracts five new customers

Qualcomm’s Snapdragon 800 processor to use TSMC’s 28HPM process

Module said to speed M2M development

Nexeon looks to commercialise silicon anode technology

4G auction raises less than expected

Beamforming sustains high data rates over short distances

Display platform upgrades the user interface and product functionality