Engineering publications brought to you by Mark Allen

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Conrad Electronic simplifies procurement of products and services

High-density 3D stack test chip

Winbond memory chip now supports NXP Layerscape LS1012A

Sensorless control pre-driver IC for BLDC motors

Scientists create the world's thinnest gold

Microchip delivers analogue embedded SuperFlash technology

Fairview Microwave introduces complete line of tunnel diode detectors

Huawei tests smartphone with own operating system

Arrow Electronics teams with ADLINK and Microsoft to enable faster IIoT deployments

Smartphones sales to fall in 2019

High-Performance 20W DC/DC converter

Soft wearable health monitor uses stretchable electronics