Engineering publications brought to you by Mark Allen

CPUs

Toshiba launches high performance Ethernet PCIe bridge IC

VSORA's Tyr chip family targets autonomous driving

CEVA unveils Bluetooth Dual Mode 5.3 SIG qualified platform

Magnachip develops next-generation OLED DDIC for automotive displays

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Meeting the AI/ML design challenge

CEVA unveils NeuPro-M heterogeneous processor architecture

Infineon unveils AURIX TC4x family of 28nm microcontrollers

In-Circuit Emulator provides feature-rich programming and debugging

ASPEED and CEVA collaborate to improve voice on Cupola360 SoCs

EIC Accelerator programme awards funding to SiPearl

MIKROE adds Waveform 4 peripheral development board

MediaTek launches Dimensity 9000 flagship chip