Engineering publications brought to you by Mark Allen

Electronics

X-FAB upgrades substrate coupling analysis tool

Agnisys announces safety qualification for software products and design flow

Volvo Cars Tech Fund invests in StoreDot

Winbond and Infineon collaborate to double bandwidth for IoT applications with HYPERRAM 3.0

Pulsonix PCB Design unveils new capabilities in Version 12.0

Turning to aged components amidst supply chain disruption

Consortium to develop photonic quantum computer

EBV Elektronik signs distribution agreement with SG Micro

Supporting Intelligence at the Edge

GCF and 5G-ACIA agree to explore industrial 5G certification needs

TouchNetix unveils latest 3D Touchless User Interfaces

Synopsys and Juniper Networks form company to target fast-growing silicon photonics market