Engineering publications brought to you by Mark Allen

Automotive

NXP unveils third-generation imaging radar processors

NOVOSENSE unveils automotive grade digital isolator range for NEVs

Power Integrations’ Switcher IC delivers reliability and space-saving benefits in 800 V BEVs

Nexperia launches automotive-qualified 1200 V SiC MOSFETs in D2PAK-7 packaging

Nexperia offering automotive planar Schottky diodes in CFP2-HP packaging

ROHM develops compact high heat dissipation SiC power modules

OMNIVISION launches image sensor for automotive driver monitoring systems

Wayve opens Testing and Development Centre in Japan

Back flip FPC connector features staggered contact array for narrow-pitch

Empowering businesses through the new Pilot Line service

ST presents a new generation of memory solutions for automotive microcontrollers

Infineon introduces new generation of energy-efficient IGBT and RC-IGBT devices for EVs