Engineering publications brought to you by Mark Allen

Industry Sectors

EnSilica unveils dual-beam, dual-polarisation Ku-band analogue beamformer chipset

TSMC set to build 9 facilities in 2025

Merck and imec to develop a disruptive MicroPhysiological Systems platform

Infineon and NVIDIA collaborate on industry-first 800V power delivery architecture for AI data centres

NXP’s AI-enabled OrangeBox 2.0 simplifies automotive security

sureCore extends sureFIT to include custom memory solutions for AI applications

Kardome and LG look to transform voice user interfaces with spatial hearing AI

Foxconn to open Europe’s first fan-out wafer level packaging plant

A new category of wearables

Archer enters partnership with Paragraf for Biochip development

Imec presents prototype of ingestible sensor for health monitoring

Renesas extends RZ/A MPU line-up with RZ/A3M for HMI solutions