Engineering publications brought to you by Mark Allen

Mixed Signal & Analogue

X-FAB releases new isolation class within its 180nm XH018 semiconductor process

Infineon integrates CAPSENSE into PSOC HV microcontrollers for smart sensors and actuators

New digital automotive audio amplifiers for smart-cockpit applications

Imec presents 150 GSa/s DAC that can achieve 300 Gb/s data transmission

sureCore launches comprehensive suite of silicon services for next generation devices

EnSilica establishes new engineering hub in Cambridge

The ‘Shift Left’ evolution in analogue mixed signal design

POLYN Technology announces first tapeout of NASP chip

Microchip introduces MCU family to simplify analogue sensor design

Blumind secures Series A funding to accelerate analogue AI development

IQE and X-FAB sign joint development agreement for GaN power

EnSilica agrees $18m design and supply ASIC contract