Engineering publications brought to you by Mark Allen

ASIC & SoC

Tool flow provides efficient chip/package/PCB codesign

Cadence, ARM sign 'broad IP interoperability agreement'

Heterogeneous computing 'one step closer', says Foundation

Latest POL module series looks to address power challenge of advanced ICs

Fully encapsulated 50A digital power module from Intersil

SoC design package improves power, performance, area 'by up to 20%'

Meeting the performance, power and intelligence needs of advanced applications

Intel launches Xeon based SoC, targets microserver designs

Xilinx takes UltraScale portfolio to 16nm

OpenVPX board boasts 16 DSP cores and four Cortex-A15s

ARM unveils Cortex-A72 core, claims performance and power boosts

Programmable digital resources can be used to overcome the shortcomings of SoC devices