Engineering publications brought to you by Mark Allen

Semiconductors

Automotive MCU family expanded to provide cost effective 2D and 3D graphics

TI claims lowest power Cortex-M4F based MCUs

Silicon Labs offers scalable car radio system solution

Manufacturers continue to push op amp precision and performance

XMOS ships first xCore200

Next generation PMBus digital controller targets high-performance computing

Tool flow provides efficient chip/package/PCB codesign

Cadence, ARM sign 'broad IP interoperability agreement'

Heterogeneous computing 'one step closer', says Foundation

Latest POL module series looks to address power challenge of advanced ICs

Fully encapsulated 50A digital power module from Intersil

Cypress, Spansion merger completes ahead of schedule