Engineering publications brought to you by Mark Allen

Semiconductors

Infineon’s PSOC 4100T Plus MCU offers advanced sensing capabilities and system control

MediaTek’s Dimensity 9400e mobile platform provides enhanced AI and connectivity

The ‘Shift Left’ evolution in analogue mixed signal design

Samsung said to be near to securing 2nm orders

POLYN Technology announces first tapeout of NASP chip

Cadence accelerates physical AI applications with Tensilica NeuroEdge 130 AI co-processor

SiFive and Kinara offer bare metal access to RISC-V Vector processors

Global SiC substrate revenue falls 9% in 2024 although long term demand remains strong

Semidynamics unveils Cervell All-in-One RISC-V NPU

The future of AI runs on the GPU

Imagination announces E-Series GPU IP for graphics and AI at the edge

Infineon’s Dresden fab receives final funding approval from German government