Engineering publications brought to you by Mark Allen

CPUs

CEVA and DARPA establish technology partnership

STMicroelectronics looks to boost IoT design productivity

Retune DSP’s Wake Word Engine available for CEVA audio/voice DSPs

Nimbix unveils multi-cloud HPC platform with support for Arm

AIStorm raises funds to commercialise AI-in-sensor chips

Aspinity releases analogue Voice-First Evaluation Kit

Qualcomm announces new Snapdragon 678 mobile platform

Socionext expands line-up of 'smart' controllers

ST and Microsoft look to boost development of smart, connected devices

STM32WL LoRa-compatible wireless system-on-chip

Renesas extends Arm Cortex-based MCU family

Codasip announces RISC-V processor cores providing multi-core and SIMD capabilities