Engineering publications brought to you by Mark Allen

CPUs

Siemen's Nucleus ReadyStart enhanced with new debug, security and stability features

NXP unveils processors on TSMC's16nm FinFET technology

Sequans licenses CEVA 5G modem IP for IoT platform

Raspberry Pi-designed RP2040 chip now available from Farnell

Winbond and Ambiq collaborate on Intelligent IoT and wearables

Osram and Infineon bring NFC programming to lighting

PAN1781 Bluetooth 5 Low Energy module

Cadence collaboration with Arm enables tape-out of next-generation mobile designs

Celeno launches chip that combines Wi-Fi, Bluetooth, and Doppler Radar

IAR Embedded Workbench supports all NXP i.MX RT crossover MCUs

First mioty LPWAN and Bluetooth LE dual stack

Renesas launches MPUs designed for entry-level AI-enabled applications.