Engineering publications brought to you by Mark Allen

Consumer

Micron starts to ship world’s first 176-Layer NAND

MediaTek targets mass market 5G smartphones with Dimensity 700

Bringing NFC wireless charging to consumer devices

Opening up the Indian market

NXP unveils low-cost, low-power, MCU-based face recognition solution

Ultra-low power positioning accuracy for wearables and asset tracking

Navigating the pathway to 5G

Dual-channel H-bridge motor driver IC with PWM control

ST unveils high-voltage gate driver with 6kV galvanic isolation

Omron supports USB-C device test with long-lasting socket

The ‘right to repair’

OPTIGA Trust Charge for secured wireless charging