Engineering publications brought to you by Mark Allen

Board Level Design

Aldec reduces ASIC design prototype bring-up time

Mouser stocking the newly released BeagleBone AI

Cadence launches Celsius Thermal Solver

Arrow Electronics launches European FPGA developer contest

Capacitors 3D printed on the DragonFly system from Nano Dimension

Pixus unveils new configurations of OpenVPX development systems

DVCon Europe announces Keynotes for 2019

Digi-Key announces partnership with Student Circuit for Freshers Week events and competition

Farnell stocking Kitronik products and accessories for micro:bit, Arduino and Raspberry Pi

19” mini-rack enclosures from METCASE

Zuken launches internet connected PCB design platform

Greener and cheaper way to make patterned metals for electronics