Engineering publications brought to you by Mark Allen

Board Level Design

Mersen unveils latest heatsink calculator

Board support package for Ka-Ro TX8 and QS8 modules

Siemens introduces PCBflow

DS-E3 StarterPackage looks to help electrical and fluid projects

Cadence unveils next-generation Palladium Z2 and Protium X2 systems

Farnell expands range of SBCs and electronics tool kits from DFRobot

Thermal evolution

Machine learning capabilities added to DFM signoff for FinFET solutions

SnapEDA launches DipTrace support

Evaluation hardware for advanced EVE graphic controllers

First complete IP solution for PCI Express 6.0

Cadence unveils next-generation Sigrity X