Engineering publications brought to you by Mark Allen

Neil Tyler

Embedded & Programmable

BoW for chiplet-to-chiplet interconnect

Embedded Systems

Murata unveils transformer for high power, high frequency applications

Displays

Ampleon launches rugged 12V LDMOS power amplifiers for land mobile radio

Wireless Technology

Rambus tapes out 112G XSR SerDes PHY on 7nm process

Interconnection

Companies to collaborate in delivering 800 Gbps connectivity

Embedded Systems

Second generation NAND for embedded applications

Power

Ricoh announces partnership agreement with Digi-Key

Power

Toshiba launches high-voltage dual-channel solenoid driver IC

The future is here and now

Communications Hardware

Renesas and StradVision to develop vision technology for autonomous vehicles

Board Level Design

Farnell sales of Raspberry Pi reach 15m worldwide

Communications Hardware

5G RuralFirst testbed announces OpenRoaming in Orkney