Engineering publications brought to you by Mark Allen

Neil Tyler

CPUs

Veoneer signs collaboration deal with Qualcomm

A resetting of China-US relations?

Distribution

Anglia expands power portfolio with UnitedSiC agreement

Vodafone invests €20 million to advance digital skills and education

Aerospace

KISPE to develop proton testing campaign for next-gen microsatellite technologies

CPUs

Semtech strengthens LoRa Core chipset portfolio

Passive Components

GCT unveils cost-effective ionex USB Type C vertical receptacles

Electric vehicle sales at the 'tipping point'

Manufacturing

High power density, 10:1 ratio DC-DC converters

Aerospace

ST looks to simplify portable GNSS receivers

ASIC & SoC

Foxconn and Winbond announce strategic investment in Kneron

Automotive

Ansys' HFSS Mesh Fusion enables the design of entire systems