Engineering publications brought to you by Mark Allen

Neil Tyler

Internet of Things

Companies testing long-distance powerline communications module

Manufacturing

New OMRON terminal blocks improve assembly efficiency

Embedded Systems

Toshiba introduces compact, but efficient, SiC MOSFET modules

Automotive

Automotive 650V CoolSiC Hybrid Discrete

Automotive

congatec launches starter set for COM-HPC with 11th Gen Intel Core processors

Farnell and element14 launch 'Women in Engineering' survey

Displays

Kerlink and Microshare collaborate on management solution

Countdown to BEEAs week

Communications Hardware

Zytronic's ElectroglaZ delivers transparent power delivery capability to its portfolio

CPUs

Edge AI chip company Syntiant announces support for Google keywords

Displays

Antenna Company launches UWB antennas

Test & Measurement

Anritsu and Tektronix introduce PCI Express 5.0 Test System