Engineering publications brought to you by Mark Allen

Neil Tyler

Automotive

Nexperia offering automotive planar Schottky diodes in CFP2-HP packaging

Robotics & UAVs

Innovate UK backed project to advance robotics in offshore wind operations

Electronics

UK scientists to tackle AI's surging energy costs with atom-thin semiconductors

Wireless Technology

Synaptics unveils first Veros Wi-Fi 7 family tailored for the IoT

Space

NEXT Semiconductor and BAE Systems to develop next generation space-qualified chips

Communications

Microchip expands data centre connectivity, storage and compute portfolios

Security

FHE specialist Lattica emerges from stealth to tackle AI security challenges

Electronics

Huawei to start testing Ascend 910D AI chips next month

Interconnection

M12 L- and T-coded connectors ensure reliability and durability

Memory

Cadence enables next-gen AI and HPC systems with ‘fastest’ IP memory system solution

Electronics

Winners and losers

Power

SemiQ 1200 V Gen3 SiC MOSFET modules reduce switching losses