Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Renesas debuts new additions to its RA0 microcontroller portfolio

Interconnection

Back flip FPC connector features staggered contact array for narrow-pitch

Electronics

TSMC remains bullish despite tariff headwinds

Electronics

Cadence to acquire Arm Artisan Foundation IP business

Power

Navitas’ SiCPAK power modules deliver reliability at high temperatures

Power

SemiQ 1200 V SiC MOSFET modules enable more compact, cost-optimised systems

Electronics

JEDEC announces release of the JESD270-4 HBM4 standard

Automotive

ST presents a new generation of memory solutions for automotive microcontrollers

Embedded Systems

Variscite extends its collaboration with QNX to include critical applications

Displays

New research suggests QD-OLEDs to account for 73% of OLED monitor shipments in 2025

Automotive

Infineon introduces new generation of energy-efficient IGBT and RC-IGBT devices for EVs

Electronics

Tariff costs start to hit home