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KIOXIA extends 8th Generation BiCS FLASH SSD portfolio with data centre NVMe SSDs

KIOXIA Europe has announced the development and demonstration of a prototype of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs.

CD9P Series PCIe 5.0 NVMe SSDs Credit: KIOXIA

These next-generation SSDs have been built with KIOXIA’s 8th generation BiCS FLASH TLC-based 3D flash memory. BiCS FLASH features CBA (CMOS directly Bonded to Array) technology, an architecture that significantly boosts power efficiency, performance, and storage density, while doubling the capacity available per SSD compared with the previous generation model.

As GPU-accelerated AI servers drive up the demands on storage infrastructure, maintaining high throughput, low latency, and consistent performance is critical - including keeping valuable GPUs highly utilised.

The KIOXIA CD9P Series has been purpose-built for these next-generation environments, delivering the speed and responsiveness required by AI, machine learning and high-performance computing workloads to ensure GPUs stay fed with data and operating at maximum efficiency.

The series leverages KIOXIA’s most advanced 3D flash memory to date, featuring a CBA-based architecture that reduces heat generation, enhances thermal management, and delivers greater overall value through improved performance and power metrics and total cost of ownership.

The KIOXIA CD9P Series drives deliver 4-corner performance improvements of up to approximately 125% in random write, 30% in random read, 20% sequential read, and 25% in sequential write speeds compared to the previous generation.

In addition, performance per watt of power consumption has improved by approximately 60% in sequential read, 45% in sequential write, 55% in random read, and 100% (2x) in random write. (Applies to the 15.36 terabyte (TB) model)

CD9P Series SSD highlights include (preliminary and subject to change):

  • PCIe 5.0, NVMe 2.0, NVMe-MI 1.2c compliant
  • Open Compute Project Datacenter NVMe SSD specification v2.5 support (Not all requirements)
  • Form factors:  2.5-inch 15 mm thickness, EDSFF E3.S
  • Read-intensive (1 DWPD) and mixed-use (3 DWPD) endurances
  • Sequential performance (128 KiB/QD32) - 14.8 GB/s Read and 7 GB/s Write
  • Random performance (4KiB) - 2,600 KIOPS (QD512) Read and 750 KIOPS (QD32) Write
  • 2.5-inch capacities up to 61.44 TB and E3.S capacities up to 30.72 TB
  • CNSA 2.0 algorithm support