Engineering publications brought to you by Mark Allen

Neil Tyler

Electronics

Foxconn to open Europe’s first fan-out wafer level packaging plant

Sensors

Archer enters partnership with Paragraf for Biochip development

Security

Microchip brings hardware quantum resistance to embedded controllers

Medical & Healthcare

Imec presents prototype of ingestible sensor for health monitoring

Displays

Renesas extends RZ/A MPU line-up with RZ/A3M for HMI solutions

Automotive

Strong reasons to be positive

Automotive

Xiphera partners with Siemens Cre8Ventures to strengthen automotive security

Electronics

Quantum technology agreement signed by EU and Japan

Memory

KIOXIA unveils NVMe SSD based on 8th Generation BiCS FLASH TLC

Electronics

Imec and TNO launch Holst Centre Photonics Lab

Consumer

Infineon’s PSOC 4100T Plus MCU offers advanced sensing capabilities and system control

Electronics

Finwave Semiconductor announces successful $8.2m funding round