Engineering publications brought to you by Mark Allen

Semiconductors

Global fab equipment spending expected to reach $100bn in 2022

SFN looks to end monopoly of Taiwanese and Korean chip producers

RZ/V Series now with built-in vision AI accelerator

Renesas introduces automotive Integrated Software Development Environment

AMD launches Ryzen Embedded V3000 Series processors

Siemens automates 2.5D and 3D IC design-for-test for next generation ICs

Synopsys unveils unified emulation and prototyping system

Key building block for 100G PON networks unveiled

Siemens and UMC develop 3D integrated circuit hybrid-bonding workflow

Arm releases next-generation Neoverse platforms

IAR Systems fully supports Renesas RZ/T2 & RZ/N2 series MPUs

SoC.one and Imagination to enable adoption of RISC-V for automotive design