Engineering publications brought to you by Mark Allen

Semiconductors

ASMPT and IBM look to advance bonding methods for chiplet packages for AI

'Banking' electronic chips

Renesas introduces the Reality AI Explorer Tier

Aitomatic announces SemiKong, an open-source LLM for the semiconductor industry

42 Technology revolutionises leak detection in semiconductor manufacturing

Samsung Electronics provides 2nm GAA process and 2.5D package to Preferred Networks

Applied Materials unveils chip wiring innovations

US-JOINT consortium to develop advanced semiconductor packaging

Global semiconductor sales jump 19.3% in year to May

ESWIN Computing presents latest RISC-V Edge Computing SoC

Intel demonstrates first fully integrated optical I/O chiplet

SiFive presents 4th generation of Essential product line